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Detail of Diamond Wheel

 

Size of Diamond abrasive grain

Products

Kind of Bond material

            Bonding Materials

 
 

Resin Bond (B/Adamas)

 
 

Metal-Resin Bond (MB)

 
 

Metal Bond (M)

 
 

Ni Electroforming Bond (EFM)

 
 

Electroplating Bond (P)

 
 

Vitrified Bond (V)

 
     

Bond hardness

     

Diamond Concentration

 
 

Selection of Bond

*Processing conditions that are the kind with various processing materials, and requested are different.As a result, if Bond of proper hardness and sharpness is not selected, it doesn‘t become it.

*The processing side quality like the chipping etc. faces the aspect low though electroformed Bond is hard and the life is long and Resin Blade is an opposite performance.

*The selah braid of the ADAMAS Co. is also energizing when processing it for the touch sensor and is suitable also for the processing of the compound material with the metal material.

     

Industry

•IC Packaging of Semiconductor

 

•SMD Electronic Components

•Opto-Electronic: LED Die

•Opto-communication Industry

 

Application

     
 

•IC BGA/CSP/QFN Substrates

 

•SMD Components

 

•LED Packaging, PCB Substrates

 

•III-V LED Wafer

 

•Silicon Wafer

 

•Glass (DWDM, CMOS Sensor), Ceramics (MLCC, LTCC)

 

, SAW Filters, Copper Lead Frame, Plastic, etc …

   
 

 

 
     
     
     
     
     
     
     
     
     
     
     
     
     
     
     
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